Microscopic metallic air-bridge arrays for connecting quantum devices
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jats:pWe present a single-exposure fabrication technique for a very large array of microscopic air-bridges using a tri-layer resist process with electron-beam lithography. The technique is capable of forming air-bridges with strong metal-metal or metal-substrate connections. This was demonstrated by its application in an electron tunneling device consisting of 400 identical surface gates for defining quantum wires, where the air-bridges are used as suspended connections for the surface gates. This technique enables us to create a large array of uniform one-dimensional channels that are open at both ends. In this article, we outline the details of the fabrication process, together with a study and the solution of the challenges present in the development of the technique, which includes the use of water-IPA (isopropyl alcohol) developer, calibration of the resist thickness, and numerical simulation of the development.</jats:p>
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1077-3118
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Engineering and Physical Sciences Research Council (EP/J01690X/1)
Engineering and Physical Sciences Research Council (EP/J003417/1)
EPSRC (1948695)
Engineering and Physical Sciences Research Council (EP/N509620/1)