In this paper, in order to improve the electrical and thermal properties of SiC/EP composites, the methods of compounding different crystalline SiC and micro-nano SiC particles are used to optimize them. Under different compound ratios, the thermal conductivity and breakdown voltage parameters of the composite material were investigated. It was found that for the SiC/EP composite materials of different crystal types of SiC, when the ratio of α and β silicon carbide is 1:1, the electrical performance of the composite material is the best, and the breakdown strength can be increased by more than 10% compared with the composite material filled with single crystal particles. For micro-nano compound SiC/EP composites, different total filling amounts of SiC correspond to different optimal ratios of micro/nano particles. At the optimal ratio, the introduction of nanoparticles can increase the breakdown strength of the composite material by more than 10%. Compared with the compound of different crystalline SiC, the advantage is that the introduction of a small amount of nanoparticles can play a strong role in enhancing the break-down field strength. For the filled composite materials, the thermal conductivity mainly depends on whether an effective heat conduction channel can be constructed. Through experiments and finite element simulation calculations, it is found that the filler shape and particle size have a greater impact on the thermal conductivity of the composite material, when the filler shape is rounder, the composite material can more effectively construct the heat conduction channel.