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AlN and Al oxy-nitride gate dielectrics for reliable gate stacks on Ge and InGaAs channels

Accepted version
Peer-reviewed

Type

Article

Change log

Authors

Guo, Y 
Robertson, J 

Abstract

jats:pAlN and Al oxy-nitride dielectric layers are proposed instead of Al2O3 as a component of the gate dielectric stacks on higher mobility channels in metal oxide field effect transistors to improve their positive bias stress instability reliability. It is calculated that the gap states of nitrogen vacancies in AlN lie further away in energy from the semiconductor band gap than those of oxygen vacancies in Al2O3, and thus AlN might be less susceptible to charge trapping and have a better reliability performance. The unfavourable defect energy level distribution in amorphous Al2O3 is attributed to its larger coordination disorder compared to the more symmetrically bonded AlN. Al oxy-nitride is also predicted to have less tendency for charge trapping.</jats:p>

Description

This is the author accepted manuscript. The final version is available from AIP Publishing via http://dx.doi.org/10.1063/1.4951004

Keywords

40 Engineering, 51 Physical Sciences, 5104 Condensed Matter Physics

Journal Title

Journal of Applied Physics

Conference Name

Journal ISSN

0021-8979
1089-7550

Volume Title

119

Publisher

AIP Publishing
Sponsorship
Engineering and Physical Sciences Research Council (EP/I014047/1)
Engineering and Physical Sciences Research Council (EP/M009297/1)
EPSRC