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GaN on Low-Resistivity Silicon THz High-Q Passive Device Technology

Accepted version
Peer-reviewed

Type

Article

Change log

Authors

Eblabla, AM 
Li, X 
Wallis, DJ 
Guiney, I 
Elgaid, K 

Abstract

In this paper, viable transmission media technology has been demonstrated for the first time on GaN on low-resistivity silicon) substrates (ρ < 40 Ω·cm) at H-band frequencies (220-325 GHz). The shielded-elevated coplanar waveguide (CPW) lines employ a standard monolithic microwave integrated circuit compatible air bridge process to elevate the CPW traces above a 5-μm layer of benzocyclobutene on shielded metalized ground plates. An insertion loss of less than 2.3 dB/mm was achieved up to 325 GHz, compared with 27 dB/mm for CPW fabricated directly on the substrate. To prove the efficiency of the technology, a short-circuited stub filter with a resonant frequency of 244 GHz was used. The filter achieved an unloaded Q-factor of 28, along with an insertion loss of 0.35 dB and a return loss of-34 dB. To our knowledge, these results are the best reported to date for GaN-based technology.

Description

Keywords

coplanar waveguides (CPWs), GaN high electron-mobility transistors (HEMTs), H-band, high-Q THz filters, low-resistivity silicon substrates, THz monolithic integrated circuits (TMICs)

Journal Title

IEEE Transactions on Terahertz Science and Technology

Conference Name

Journal ISSN

2156-342X
2156-3446

Volume Title

7

Publisher

IEEE
Sponsorship
Engineering and Physical Sciences Research Council (EP/N01202X/1)
This work was supported by the EPSRC under Grant EP/N014820/1.