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dc.contributor.authorZhang, Z
dc.contributor.authorPivnenko, M
dc.contributor.authorMedina-Salazar, I
dc.contributor.authorYou, Z
dc.contributor.authorChu, D
dc.date.accessioned2018-02-28T18:29:29Z
dc.date.available2018-02-28T18:29:29Z
dc.date.issued2016-09-01
dc.identifier.issn0954-4054
dc.identifier.urihttps://www.repository.cam.ac.uk/handle/1810/273641
dc.description.abstractIn this article, quality analysis of the assembled phase-only liquid crystal on silicon devices is presented ba sed on experiences using the flexibility and scalability of die-level assembly process. The research contents mainly consist of quality control and optimisation of liquid crystal filling process and device overall quality assessment including the thickness uniformity of liquid crystal layer with post-assembly inspection. To summarise, pre-production prototype phase-only liquid crystal on silicon devices with high quality has been developed in high reproducibility using a die-level assembly process, the robust glue deposition is performed, liquid crystal filling process in isotropic phase is presented and thickness variation can be controlled in the range of γ/4.
dc.description.sponsorshipThis work was supported by State Key Laboratory of Precision Measurement Technology and Instruments, Tsinghua University. It was also supported by National Natural Science Foundation of China (61307077), Beijing Natural Science Foundation (4144076), China Postdoctoral Science Foundation (2013M530613), the UK Engineering and Physical Sciences Research Council (EPSRC) through the Platform Grant in liquid crystal photonics (EP/F00897X/1) and the Cambridge Integrated Knowledge Centre (CIKC) through projects PASSBACK and PASSBACK3.
dc.publisherSAGE Publications
dc.subjectliquid crystal on silicon
dc.subjectphase-only
dc.subjectdie-level assembly
dc.subjectliquid crystal filling
dc.titleAdvanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices
dc.typeArticle
prism.endingPage1664
prism.issueIdentifier9
prism.publicationDate2016
prism.publicationNameProceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
prism.startingPage1659
prism.volume230
dc.identifier.doi10.17863/CAM.17433
dcterms.dateAccepted2015-02-24
rioxxterms.versionofrecord10.1177/0954405415578583
rioxxterms.versionAM
rioxxterms.licenseref.urihttp://www.rioxx.net/licenses/all-rights-reserved
rioxxterms.licenseref.startdate2016-09-01
dc.contributor.orcidPivnenko, Mike [0000-0001-9071-3693]
dc.contributor.orcidChu, Daping [0000-0001-9989-6238]
dc.identifier.eissn2041-2975
rioxxterms.typeJournal Article/Review
pubs.funder-project-idEngineering and Physical Sciences Research Council (EP/F00897X/1)
cam.issuedOnline2015-04-07


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