Repository logo
 

Investigating the Dislocation-Driven Micro-mechanical Response Under Non-isothermal Creep Conditions in Single-Crystal Superalloys

Published version
Peer-reviewed

Type

Article

Change log

Authors

Cormier, J 
Jones, CN 
Galindo-Nava, E 
Rae, CMF 

Abstract

jats:titleAbstract</jats:title> jats:pThe creep responses of the superalloy CMSX-4 under thermal cycling conditions (900 °C to 1050 °C) and constant load (jats:inline-formula jats:alternatives jats:tex-math$$ \sigma_{0} = 200 MPa $$</jats:tex-math> <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"> mml:mrow mml:msub mml:miσ</mml:mi> mml:mn0</mml:mn> </mml:msub> mml:mo=</mml:mo> mml:mn200</mml:mn> mml:miM</mml:mi> mml:miP</mml:mi> mml:mia</mml:mi> </mml:mrow> </mml:math> </jats:alternatives> </jats:inline-formula>) were analyzed using TEM dislocation analysis and compared to the modeled evolution of key creep parameters. By studying tests interrupted at different stages of creep, it is argued that the thermal cycling creep rate under these conditions depends on the creation of interfacial dislocation networks and their disintegration by the jats:italicγ</jats:italic>′-shear of dissimilar Burgers vector pairs.</jats:p>

Description

Keywords

Creep Non-isothermal, Modelling

Journal Title

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Conference Name

Journal ISSN

1073-5623
1543-1940

Volume Title

49

Publisher

Springer Science and Business Media LLC
Sponsorship
EPSRC (1505208)
Engineering and Physical Sciences Research Council (EP/H500375/1)
Engineering and Physical Sciences Research Council (EP/H022309/1)
Engineering and Physical Sciences Research Council (EP/M005607/1)
The authors would like to thank Rolls-Royce plc and the Engineering and Physical Sciences Research Council (EPSRC) for financial support under the Strategic Partnership, Grant Numbers EP/H022309/1 and EP/H500375/1. E.I. Galindo-Nava would like to acknowledge the Royal Academy of Engineering for his research fellowship funding.