An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.
View / Open Files
Authors
Mansoor, Mohtashim
Haneef, Ibraheem
Akhtar, Suhail
Rafiq, Muhammad Aftab
Ali, Syed Zeeshan
Publication Date
2016-11-04Journal Title
Sensors (Basel)
ISSN
1424-8220
Publisher
MDPI AG
Volume
16
Issue
11
Language
eng
Type
Article
This Version
VoR
Physical Medium
Electronic
Metadata
Show full item recordCitation
Mansoor, M., Haneef, I., Akhtar, S., Rafiq, M. A., De Luca, A., Ali, S. Z., & Udrea, F. (2016). An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.. Sensors (Basel), 16 (11) https://doi.org/10.3390/s16111608
Abstract
An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA-0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C-1.79 mV/°C in the range 20-300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)-0.1 in the tested range of 0-4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.
Keywords
CMOS, DRIE, MEMS, SOI, aerospace, dense sensor packing, fluid dynamics, multi-sensor, piezoresistive pressure sensor, sensor system, thermal flow rate sensor, thermodiodes
Sponsorship
European Commission (288481)
Identifiers
External DOI: https://doi.org/10.3390/s16111608
This record's URL: https://www.repository.cam.ac.uk/handle/1810/286875
Statistics
Total file downloads (since January 2020). For more information on metrics see the
IRUS guide.
Recommended or similar items
The current recommendation prototype on the Apollo Repository will be turned off on 03 February 2023. Although the pilot has been fruitful for both parties, the service provider IKVA is focusing on horizon scanning products and so the recommender service can no longer be supported. We recognise the importance of recommender services in supporting research discovery and are evaluating offerings from other service providers. If you would like to offer feedback on this decision please contact us on: support@repository.cam.ac.uk