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dc.contributor.authorParab, Virendra
dc.contributor.authorPrasad, Oppili
dc.contributor.authorPillai, Sreelal
dc.contributor.authorSambandan, Sanjiv
dc.date.accessioned2020-01-30T01:52:24Z
dc.date.available2020-01-30T01:52:24Z
dc.date.issued2019-12-23
dc.identifier.issn2045-2322
dc.identifier.other31873091
dc.identifier.otherPMC6928145
dc.identifier.urihttps://www.repository.cam.ac.uk/handle/1810/301479
dc.description.abstractOpen circuit faults in electronic systems are a common failure mechanism, particularly in large area electronic systems such as display and image sensor arrays, flexible electronics and wearable electronics. To address this problem several methods to self heal open faults in real time have been investigated. One approach of interest to this work is the electric field assisted self-healing (eFASH) of open faults. eFASH uses a low concentration dispersion of conductive particles in an insulating fluid that is packaged over the interconnect. The electric field appearing in the open fault in a current carrying interconnect polarizes the conductive particles and chains them up to create a heal. This work studies the impact of dispersion concentration on the heal time, heal impedance and cross-talk when eFASH is used for self-healing. Theoretical predictions are supported by experimental evidence and an optimum dispersion concentration for effective self-healing is identified.
dc.languageeng
dc.rightsAttribution 4.0 International
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.sourceessn: 2045-2322
dc.sourcenlmid: 101563288
dc.titleElectric Field Assisted Self-Healing of Open Circuits with Conductive Particle-Insulating Fluid Dispersions: Optimizing Dispersion Concentration.
dc.typeArticle
dc.date.updated2020-01-30T01:52:23Z
dc.identifier.doi10.17863/CAM.48551
rioxxterms.versionofrecord10.1038/s41598-019-55801-8
rioxxterms.versionVoR
rioxxterms.licenseref.urihttps://creativecommons.org/licenses/by/4.0/


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Attribution 4.0 International
Except where otherwise noted, this item's licence is described as Attribution 4.0 International