Molecular simulation of thermoset curing: application to 3D printing materials
Accepted version
Peer-reviewed
Repository URI
Repository DOI
Change log
Authors
Jenei, M
Robertson, S
Description
Keywords
3D printing, molecular dynamics simulation, polymerisation, COMPASS III, thermoset curing
Journal Title
Molecular Simulation
Conference Name
Journal ISSN
0892-7022
1029-0435
1029-0435
Volume Title
47
Publisher
Informa UK Limited
Publisher DOI
Rights
All rights reserved
Sponsorship
EPSRC (1948669)