Research on the Compound Optimization Method of the Electrical and Thermal Properties of SiC/EP Composite Insulating Material.
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Authors
Song, Xupeng
Xue, Xiaofeng
Qi, Wen
Zhang, Jin
Zhou, Yang
Yang, Wei
Zhang, Yiran
Lin, Jun
Publication Date
2021-09-30Journal Title
Polymers (Basel)
ISSN
2073-4360
Publisher
MDPI AG
Volume
13
Issue
19
Language
eng
Type
Article
This Version
VoR
Metadata
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Song, X., Xue, X., Qi, W., Zhang, J., Zhou, Y., Yang, W., Zhang, Y., et al. (2021). Research on the Compound Optimization Method of the Electrical and Thermal Properties of SiC/EP Composite Insulating Material.. Polymers (Basel), 13 (19) https://doi.org/10.3390/polym13193369
Abstract
In this paper, in order to improve the electrical and thermal properties of SiC/EP composites, the methods of compounding different crystalline SiC and micro-nano SiC particles are used to optimize them. Under different compound ratios, the thermal conductivity and breakdown voltage parameters of the composite material were investigated. It was found that for the SiC/EP composite materials of different crystal types of SiC, when the ratio of α and β silicon carbide is 1:1, the electrical performance of the composite material is the best, and the breakdown strength can be increased by more than 10% compared with the composite material filled with single crystal particles. For micro-nano compound SiC/EP composites, different total filling amounts of SiC correspond to different optimal ratios of micro/nano particles. At the optimal ratio, the introduction of nanoparticles can increase the breakdown strength of the composite material by more than 10%. Compared with the compound of different crystalline SiC, the advantage is that the introduction of a small amount of nanoparticles can play a strong role in enhancing the break-down field strength. For the filled composite materials, the thermal conductivity mainly depends on whether an effective heat conduction channel can be constructed. Through experiments and finite element simulation calculations, it is found that the filler shape and particle size have a greater impact on the thermal conductivity of the composite material, when the filler shape is rounder, the composite material can more effectively construct the heat conduction channel.
Keywords
SiC crystal form, breakdown field strength, micro-nano compound, thermal conductivity
Sponsorship
Fundamental Research Funds for the Central Universities (2019MS011)
National Key Research and Development Program of China (2017YFB0903800)
State Key Laboratory of Reliability and Intelligence of Electrical Equipment (EERIKF2019002)
Identifiers
PMC8512577, 34641181
External DOI: https://doi.org/10.3390/polym13193369
This record's URL: https://www.repository.cam.ac.uk/handle/1810/330808
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