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dc.contributor.authorAbdulrhman, M
dc.contributor.authorZhakeyev, A
dc.contributor.authorFernández-Posada, CM
dc.contributor.authorMelchels, FPW
dc.contributor.authorMarques-Hueso, J
dc.date.accessioned2022-05-11T09:00:08Z
dc.date.available2022-05-11T09:00:08Z
dc.date.issued2022-06-01
dc.date.submitted2021-12-03
dc.identifier.issn2058-8585
dc.identifier.otherfpeac6b6e
dc.identifier.otherac6b6e
dc.identifier.otherfpe-100604.r2
dc.identifier.urihttps://www.repository.cam.ac.uk/handle/1810/337007
dc.description.abstract<jats:title>Abstract</jats:title> <jats:p>The electronic industry has room for improvement in adopting cleaner strategies, both in production processes (often energy-intensive and polluting) and in waste management. Many small components like security tags are routinely disposed of via general waste, which could be reduced adopting biodegradable polymers. In this work, a method for selective deposition of metallic micro-tracks on polycaprolactone (PCL) for circuitry integration is presented. The polymer is biodegradable, flexible, suitable for 3D printing, and can be obtained from sustainable sources. Photoreduction of Ag ions was used to generate seeds for subsequent selective electroless copper (Cu) plating in a process that avoids common but undesirable compounds such as cyanides and palladium. Two different photopatterning methods were successfully used to achieve selective Cu plating: flood exposure with a 460 nm light-emitting diode (LED) and direct laser writing (DLW) using a 405 nm laser, achieving 47 ± 11 <jats:italic>μ</jats:italic>m wide tracks. The deposition of uniform Cu layers on PCL substrates is demonstrated, with thicknesses of up to 14 <jats:italic>μ</jats:italic>m and electrical conductivities of up to 2.06 × 10<jats:sup>7</jats:sup> S m<jats:sup>−1</jats:sup>, which is near the conductivity of bulk Cu (5.89 × 10<jats:sup>7</jats:sup> S m<jats:sup>−1</jats:sup>). Cu-plated interconnects were demonstrated to be fully functional for powering a 5 SMD LEDs circuit. Furthermore, DLW enabled the interconnect manufacturing on an uneven substrate. This method is flexible, selective, low-cost, vacuum-free and of minimized environmental impact, and it provides a new route towards the manufacturing of biodegradable electronics.</jats:p>
dc.languageen
dc.publisherIOP Publishing
dc.subjectPaper
dc.subjectbiodegradable
dc.subjectlaser writing
dc.subjectelectroless copper plating
dc.subjectselective metallization
dc.subjectpolycaprolactone (PCL)
dc.titleRoutes towards manufacturing biodegradable electronics with polycaprolactone (PCL) via direct light writing and electroless plating
dc.typeArticle
dc.date.updated2022-05-11T09:00:07Z
prism.issueIdentifier2
prism.publicationNameFlexible and Printed Electronics
prism.volume7
dc.identifier.doi10.17863/CAM.84427
dcterms.dateAccepted2022-04-28
rioxxterms.versionofrecord10.1088/2058-8585/ac6b6e
rioxxterms.versionVoR
rioxxterms.licenseref.urihttp://creativecommons.org/licenses/by/4.0
dc.contributor.orcidAbdulrhman, M [0000-0001-5306-5711]
dc.contributor.orcidZhakeyev, A [0000-0003-2571-5398]
dc.contributor.orcidFernández-Posada, CM [0000-0003-3080-1637]
dc.contributor.orcidMelchels, FPW [0000-0002-5881-837X]
dc.contributor.orcidMarques-Hueso, J [0000-0002-1807-3369]
dc.identifier.eissn2058-8585
pubs.funder-project-idEngineering and Physical Sciences Research Council (EP/R00661X/1, EP/T013680/1)
pubs.funder-project-idLibyan Government (Ref 13691)
cam.issuedOnline2022-05-11


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