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Collagen Film Activation with Nanoscale IKVAV-Capped Dendrimers for Selective Neural Cell Response.

Accepted version
Peer-reviewed

Type

Article

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Authors

Bax, Daniel V 
Murphy, Robert 
Cameron, Ruth E 

Abstract

Biocompatible neural guidance conduits are alternatives to less abundant autologous tissue grafts for small nerve gap injuries. To address larger peripheral nerve injuries, it is necessary to design cell selective biomaterials that attract neuronal and/or glial cells to an injury site while preventing the intrusion of fibroblasts that cause inhibitory scarring. Here, we investigate a potential method for obtaining this selective cellular response by analysing the responses of rat Schwann cells and human dermal fibroblasts to isoleucine-lysine-valine-alanine-valine (IKVAV)-capped dendrimer-activated collagen films. A high quantity of nanoscale IKVAV-capped dendrimers incorporated onto pre-crosslinked collagen films promoted rat Schwann cell attachment and proliferation, and inhibited human dermal fibroblast proliferation. In addition, while pre-crosslinked dendrimer-activated films inhibited fibroblast proliferation, non-crosslinked dendrimer-activated films and films that were crosslinked after dendrimer-activation (post-crosslinked films) did not. The different cellular responses to pre-crosslinked and post-crosslinked films highlight the importance of having fully exposed, non-covalently bound biochemical motifs (pre-crosslinked films) directing certain cellular responses. These results also suggest that high concentrations of nanoscale IKVAV motifs can inhibit fibroblast attachment to biological substrates, such as collagen, which inherently attract fibroblasts. Therefore, this work points toward the potential of IKVAV-capped dendrimer-activated collagen biomaterials in limiting neuropathy caused by fibrotic scarring at peripheral nerve injury sites.

Description

Keywords

IKVAV pentapeptide, bioactivated materials, collagen, dendrimers

Journal Title

Nanomaterials (Basel)

Conference Name

Journal ISSN

2079-4991
2079-4991

Volume Title

11

Publisher

MDPI AG

Rights

All rights reserved
Sponsorship
Engineering and Physical Sciences Research Council (EP/N019938/1)
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