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Analysis of the Electrical and Thermal Properties for Magnetic Fe3O4-Coated SiC-Filled Epoxy Composites.

Published version
Peer-reviewed

Type

Article

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Authors

Zhang, Yiran 
Gong, Yangzhi 
Wang, Kun 
Chen, Yun 

Abstract

Orderly arranged Silicon carbide (SiC)/epoxy (EP) composites were fabricated. SiC was made magnetically responsive by decorating the surface with iron oxide (Fe3O4) nanoparticles. Three treatment methods, including without magnetization, pre-magnetization and curing magnetization, were used to prepare SiC/EP composites with different filler distributions. Compared with unmodified SiC, magnetic SiC with core-shell structure was conducive to improve the breakdown strength of SiC/EP composites and the maximum enhancement rate was 20.86%. Among the three treatment methods, SiC/EP composites prepared in the curing-magnetization case had better comprehensive properties. Under the action of magnetic field, magnetic SiC were orderly oriented along the direction of an external field, thereby forming SiC chains. The magnetic alignment of SiC restricted the movement of EP macromolecules or polar groups to some extent, resulting in the decrease in the dielectric constant and dielectric loss. The SiC chains are equivalent to heat flow channels, which can improve the heat transfer efficiency, and the maximum improvement rate was 23.6%. The results prove that the orderly arrangement of SiC had a favorable effect on dielectric properties and thermal conductivity of SiC/EP composites. For future applications, the orderly arranged SiC/EP composites have potential for fabricating insulation materials in the power electronic device packaging field.

Description

Keywords

breakdown strength, dielectric properties, magnetization treatment, orderly arrangement, silicon carbide, thermal conductivity

Journal Title

Polymers (Basel)

Conference Name

Journal ISSN

2073-4360
2073-4360

Volume Title

13

Publisher

MDPI AG
Sponsorship
National Key Research and Development Program of China (No. 2017YFB0903800)
Fundamental Research Funds for the Central Universities (No.2019MS011)
State Key Laboratory of Reliability and Intelligence of Electrical Equipment (No. EERIKF2019002)