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In Situ Investigation of TCP Phase Formation, Stress Relaxation and γ/γ′ Lattice Misfit Evolution in Fourth Generation Single Crystal Ni-Base Superalloys by X-Ray High Temperature Diffraction

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Bezold, A 
Stone, HJ 
Rae, CMF 


jats:titleAbstract</jats:title> jats:pIn nickel-based superalloys, the lattice misfit between the jats:italicγ</jats:italic> and jats:italicγ</jats:italic>′ phases and the propensity to TCP phase formation at service temperatures critically influence the microstructural evolution that takes place and hence the resultant mechanical properties. In this work, the lattice misfits of a series of highly alloyed Ru-containing 4th generation Ni-base superalloys are investigated by jats:italicin situ</jats:italic> X-ray diffraction (XRD) at high temperature. While the lattice misfit values of all alloys range between − 0.3 and − 1.3 pct at room temperature, they show an atypical temperature dependence, becoming less negative above 900 °C. jats:italicIn situ</jats:italic> XRD measurements at 1100 °C reveal that the majority of the internal coherency stresses are already relieved after two hours. This is particularly pronounced for the alloys that have both a lattice misfit larger than |0.6| pct at 1100 °C and are prone to TCP phase formation. However, throughout the relaxation of the internal coherency stresses the lattice misfit remains fairly constant. Due to the similar chemical compositions of the alloys studied, qualitative guidelines for an optimum lattice misfit magnitude are developed by comparing the lattice misfit values with previous creep experiments. Our results indicate that no universal optimal lattice misfit value exists for these alloys and the value strongly depends on the applied creep conditions.</jats:p> jats:p jats:boldGraphical Abstract</jats:bold> </jats:p>


Funder: Friedrich-Alexander-Universität Erlangen-Nürnberg (1041)


40 Engineering, 4016 Materials Engineering, 4017 Mechanical Engineering

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Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

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Springer Science and Business Media LLC