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An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.

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cam.issuedOnline2016-11-04
dc.contributor.authorMansoor, Mohtashim
dc.contributor.authorHaneef, Ibraheem
dc.contributor.authorAkhtar, Suhail
dc.contributor.authorRafiq, Muhammad Aftab
dc.contributor.authorDe Luca, Andrea
dc.contributor.authorAli, Syed Zeeshan
dc.contributor.authorUdrea, Florin
dc.contributor.orcidDe Luca, Andrea [0000-0002-9481-4747]
dc.contributor.orcidUdrea, Florin [0000-0002-7288-3370]
dc.date.accessioned2018-12-14T00:30:15Z
dc.date.available2018-12-14T00:30:15Z
dc.date.issued2016-11-04
dc.description.abstractAn SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA-0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C-1.79 mV/°C in the range 20-300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)-0.1 in the tested range of 0-4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.
dc.format.mediumElectronic
dc.identifier.doi10.17863/CAM.34184
dc.identifier.eissn1424-8220
dc.identifier.issn1424-8220
dc.identifier.urihttps://www.repository.cam.ac.uk/handle/1810/286875
dc.languageeng
dc.language.isoeng
dc.publisherMDPI AG
dc.publisher.urlhttp://dx.doi.org/10.3390/s16111608
dc.rightsAttribution 4.0 International
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subjectCMOS
dc.subjectDRIE
dc.subjectMEMS
dc.subjectSOI
dc.subjectaerospace
dc.subjectdense sensor packing
dc.subjectfluid dynamics
dc.subjectmulti-sensor
dc.subjectpiezoresistive pressure sensor
dc.subjectsensor system
dc.subjectthermal flow rate sensor
dc.subjectthermodiodes
dc.titleAn SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.
dc.typeArticle
dcterms.dateAccepted2016-09-02
prism.issueIdentifier11
prism.publicationDate2016
prism.publicationNameSensors (Basel)
prism.volume16
pubs.funder-project-idEuropean Commission (288481)
rioxxterms.licenseref.startdate2016-11-04
rioxxterms.licenseref.urihttp://www.rioxx.net/licenses/all-rights-reserved
rioxxterms.typeJournal Article/Review
rioxxterms.versionVoR
rioxxterms.versionofrecord10.3390/s16111608

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