Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices
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Publication Date
2016-09-01Journal Title
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
ISSN
0954-4054
Publisher
SAGE Publications
Volume
230
Issue
9
Pages
1659-1664
Type
Article
This Version
AM
Metadata
Show full item recordCitation
Zhang, Z., Pivnenko, M., Medina-Salazar, I., You, Z., & Chu, D. (2016). Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 230 (9), 1659-1664. https://doi.org/10.1177/0954405415578583
Abstract
In this article, quality analysis of the assembled phase-only liquid crystal on silicon devices is presented ba sed on experiences using the flexibility and scalability of die-level assembly process. The research contents mainly consist of quality control and optimisation of liquid crystal filling process and device overall quality assessment including the thickness uniformity of liquid crystal layer with post-assembly inspection. To summarise, pre-production prototype phase-only liquid crystal on silicon devices with high quality has been developed in high reproducibility using a die-level assembly process, the robust glue deposition is performed, liquid crystal filling process in isotropic phase is presented and thickness variation can be controlled in the range of γ/4.
Keywords
liquid crystal on silicon, phase-only, die-level assembly, liquid crystal filling
Sponsorship
This work was supported by State Key Laboratory of Precision Measurement Technology and Instruments, Tsinghua University. It was also supported by National Natural Science Foundation of China (61307077), Beijing Natural Science Foundation (4144076), China
Postdoctoral Science Foundation (2013M530613), the UK Engineering and Physical Sciences Research Council (EPSRC) through the Platform Grant in liquid crystal photonics (EP/F00897X/1) and the Cambridge Integrated Knowledge Centre (CIKC) through projects PASSBACK and PASSBACK3.
Funder references
Engineering and Physical Sciences Research Council (EP/F00897X/1)
Identifiers
External DOI: https://doi.org/10.1177/0954405415578583
This record's URL: https://www.repository.cam.ac.uk/handle/1810/273641
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