Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
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Zhang, Z., Pivnenko, M., Medina-Salazar, I., You, Z., & Chu, D. (2016). Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 230 (9), 1659-1664. https://doi.org/10.1177/0954405415578583
In this article, quality analysis of the assembled phase-only liquid crystal on silicon devices is presented ba sed on experiences using the flexibility and scalability of die-level assembly process. The research contents mainly consist of quality control and optimisation of liquid crystal filling process and device overall quality assessment including the thickness uniformity of liquid crystal layer with post-assembly inspection. To summarise, pre-production prototype phase-only liquid crystal on silicon devices with high quality has been developed in high reproducibility using a die-level assembly process, the robust glue deposition is performed, liquid crystal filling process in isotropic phase is presented and thickness variation can be controlled in the range of γ/4.
liquid crystal on silicon, phase-only, die-level assembly, liquid crystal filling
This work was supported by State Key Laboratory of Precision Measurement Technology and Instruments, Tsinghua University. It was also supported by National Natural Science Foundation of China (61307077), Beijing Natural Science Foundation (4144076), China Postdoctoral Science Foundation (2013M530613), the UK Engineering and Physical Sciences Research Council (EPSRC) through the Platform Grant in liquid crystal photonics (EP/F00897X/1) and the Cambridge Integrated Knowledge Centre (CIKC) through projects PASSBACK and PASSBACK3.
Engineering and Physical Sciences Research Council (EP/F00897X/1)
External DOI: https://doi.org/10.1177/0954405415578583
This record's URL: https://www.repository.cam.ac.uk/handle/1810/273641