Repository logo
 

Validated physical models and parameters of bulk 3C–SiC aiming for credible technology computer aided design (TCAD) simulation

Accepted version
Peer-reviewed

Loading...
Thumbnail Image

Change log

Abstract

The cubic form of SiC (β- or 3C-) compared to the hexagonal α-SiC polytypes, primarily 4H- and 6H–SiC, has lower growth cost and can be grown heteroepitaxially in large area silicon (Si) wafers which makes it of special interest. This in conjunction with the recently reported growth of improved quality 3C–SiC, make the development of devices an imminent objective. However, the readiness of models that accurately predict the material characteristics, properties and performance is an imperative requirement for attaining the design and optimization of functional devices. The purpose of this study is to provide and validate a comprehensive set of models alongside with their parameters for bulk 3C–SiC. The validation process revealed that the proposed models are in a very good agreement to experimental data and confidence ranges were identified. This is the first piece of work achieving that for 3C–SiC. Considerably, it constitutes the necessary step for finite element method simulations and technology computer aided design.

Description

Journal Title

Semiconductor Science and Technology

Conference Name

Journal ISSN

0268-1242
1361-6641

Volume Title

32

Publisher

IOP Publishing

Rights and licensing

Except where otherwised noted, this item's license is described as http://www.rioxx.net/licenses/all-rights-reserved