Stress dissipation in cucurbit[8]uril ternary complex small molecule adhesives.
Authors
Williams, Paul
Walsh-Korb, Zarah
Jones, Samuel
Lan, Yang
Scherman, Oren A
Publication Date
2018-07-02Journal Title
Langmuir
ISSN
0743-7463
Publisher
American Chemical Society
Volume
34
Issue
44
Pages
13104-13109
Language
eng
Type
Article
This Version
AM
Metadata
Show full item recordCitation
Williams, P., Walsh-Korb, Z., Jones, S., Lan, Y., & Scherman, O. A. (2018). Stress dissipation in cucurbit[8]uril ternary complex small molecule adhesives.. Langmuir, 34 (44), 13104-13109. https://doi.org/10.1021/acs.langmuir.8b00894
Abstract
The ability to control supramolecular and macroscopic self-assembly and disassembly holds great potential for responsive, reversible adhesives that can efficiently broker stresses accumulated between two surfaces. Here, cucurbit[8]uril is used to directly adhere two functionalized mica substrates creating surface-surface interactions that are held together through photo-reversible CB[8] heteroternary complexes. Comparison of single molecule, bulk and macroscopic adhesion behavior give insight into cooperativity and stress dissipation in dynamic adhesive systems.
Keywords
0306 Physical Chemistry (incl. Structural), 0303 Macromolecular and Materials Chemistry, Behavioral and Social Science
Sponsorship
Engineering and Physical Sciences Research Council (EP/H007024/1)
Engineering and Physical Sciences Research Council (EP/L027151/1)
Engineering and Physical Sciences Research Council (EP/G060649/1)
Identifiers
External DOI: https://doi.org/10.1021/acs.langmuir.8b00894
This record's URL: https://www.repository.cam.ac.uk/handle/1810/280590
Rights
Licence:
http://www.rioxx.net/licenses/all-rights-reserved
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