Stress dissipation in cucurbit[8]uril ternary complex small molecule adhesives.
Publication Date
2018-07-02Journal Title
Langmuir
ISSN
0743-7463
Publisher
American Chemical Society
Volume
34
Issue
44
Pages
13104-13109
Language
eng
Type
Article
This Version
AM
Metadata
Show full item recordCitation
Williams, P., Walsh-Korb, Z., Jones, S., Lan, Y., & Scherman, O. (2018). Stress dissipation in cucurbit[8]uril ternary complex small molecule adhesives.. Langmuir, 34 (44), 13104-13109. https://doi.org/10.1021/acs.langmuir.8b00894
Abstract
The ability to control supramolecular and macroscopic self-assembly and disassembly holds great potential for responsive, reversible adhesives that can efficiently broker stresses accumulated between two surfaces. Here, cucurbit[8]uril is used to directly adhere two functionalized mica substrates creating surface-surface interactions that are held together through photo-reversible CB[8] heteroternary complexes. Comparison of single molecule, bulk and macroscopic adhesion behavior give insight into cooperativity and stress dissipation in dynamic adhesive systems.
Sponsorship
Engineering and Physical Sciences Research Council (EP/H007024/1)
Engineering and Physical Sciences Research Council (EP/L027151/1)
Identifiers
External DOI: https://doi.org/10.1021/acs.langmuir.8b00894
This record's URL: https://www.repository.cam.ac.uk/handle/1810/280590
Rights
Licence:
http://www.rioxx.net/licenses/all-rights-reserved
Statistics
Total file downloads (since January 2020). For more information on metrics see the
IRUS guide.