Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics
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Organic mixed ionic‐electronic conductors have emerged as a key material for the development of bioelectronic devices due to their soft mechanical properties, biocompatibility, and high volumetric capacitance. In particular, PEDOT:PSS has become a choice material because it is highly conductive, easily processible, and commercially available. However, PEDOT:PSS is dispersible in water, leading to delamination of films when exposed to biological environments. For this reason, chemical cross–linking agents such as (3‐glycidyloxypropyl)trimethoxysilane (GOPS) are used to stabilize PEDOT:PSS films in water, but at the cost of decreased electrical performance. Here, it is shown that PEDOT:PSS thin films become water‐stable by simply baking at high temperatures (>150 °C) for a short time (≈ 2 min). It is shown that heat‐treated PEDOT:PSS films are as stable as their chemically‐cross–linked counterparts, with their performance maintained for >20 days both in vitro and in vivo. The heat‐treated films eliminate electrically insulating cross–linkers, resulting in a 3× increase in volumetric capacitance. Applying thermal energy using a focused femtosecond laser enables direct patterning of 3D PEDOT:PSS microstructures. The thermal treatment method is compatible with a wide range of substrates and is readily substituted into existing workflows for manufacturing devices, enabling its rapid adoption in the field of bioelectronics.
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Publication status: Published
Funder: Meta Research; doi: http://dx.doi.org/10.13039/100021856
Funder: Wu Tsai Neurosciences Institute, Stanford University; doi: http://dx.doi.org/10.13039/100014373
Funder: Wellcome Trust; doi: http://dx.doi.org/10.13039/100010269
Funder: Wu Tsai Human Performance Alliance
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1521-4095
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Cambridge (EP/P024947/1)
Engineering and Physical Sciences Research Council (EP/W017091/1)
Henry Royce Institute (EP/R00661X/1)
H2020 European Research Council (101022365)
Division of Electrical, Communications and Cyber Systems (ECCS‐1542152)

