Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer
Published version
Peer-reviewed
Repository URI
Repository DOI
Change log
Description
Journal Title
Light Advanced Manufacturing
Conference Name
Journal ISSN
2831-4093
2831-4093
2831-4093
Volume Title
5
Publisher
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences
Publisher DOI
Rights and licensing
Except where otherwised noted, this item's license is described as Attribution 4.0 International (CC BY 4.0)
Sponsorship
EPSRC (via University College London (UCL)) (EP/T028475/1)

