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Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer

Published version
Peer-reviewed

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Description

Journal Title

Light Advanced Manufacturing

Conference Name

Journal ISSN

2831-4093
2831-4093

Volume Title

5

Publisher

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences

Rights and licensing

Except where otherwised noted, this item's license is described as Attribution 4.0 International (CC BY 4.0)
Sponsorship
EPSRC (via University College London (UCL)) (EP/T028475/1)

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